The seafood packaging market , valued at USD 1.3 billion in 2024, is projected to exceed USD 2 billion by 2034, reflecting a steady CAGR of 4.3%. This growth is driven by increasing global demand for ...

The growing global food industry and rising sales of ready-to-eat and dairy products are driving increased demand for durable and efficient rigid food packaging Ankush Nikam Future Market Insights, ...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

Apple will be taking advantage of TSMC’s very latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal). SoIC-mH refers to a method of integrating different ...

It’s believed some of the upcoming M5 chips will also use TSMC’s 2.5D packaging technology. Apple’s M-series Mac chips each include a central processing unit, a graphics processing unit ...

The US Commerce Department has awarded $458m in funding to memory chip maker SK Hynix for developing an advanced chip packaging facility in Indiana. This funding, under the CHIPS Incentives ...

The concept of the lab-on-a-chip, or micro-total analytical system, is intricately linked to the idea of single-use. The majority of microfluidic, lab-on-chip or point-of-care devices are made out ...

The U.S. Commerce Department on Thursday finalized an award to SK Hynix (000660.KS), opens new tab of up to $458 million in government grants to help fund an advanced chip packaging plant and ...