One of the most complex parts of this process is lithography: the step in which shapes are drawn onto a silicon wafer. There are several ways to do this, all of them rather complicated ...
“During the etching process, we use plasma to selectively remove material to build minuscule structures in chips. The etch process often uses gasses such as the fluorinated chemical CF4 ...
Semiconductor industry is moving towards the deep sub micron technology where the channel length of the device becomes as small as 65/40/32/28 nm and beyond. Fabrication of these smaller devices is a ...
wafer level that mean activities, and this is by optical as well. And this is intrinsic new elements, very different than silicon, that creates as well a lot of challenges for the yield of the entire ...