But one of the major challenges that still remains is using of FPGA for large SoC design. One of the major differences between FPGA and ASIC is availability of resource. In ASIC the designers need not ...

BETTER LINK UTILIZATION The reduced latency of RapidChip technology vs. an FPGA can also translate into in superior link utilization. For example, consider the utilization of a PCI Express egress link ...

ADLINK’s I-Pi SMARC Amston Lake is a fanless development kit based on SMARC 2.1-compliant system-on-module with an Intel Atom X7433RE quad-core SoC, 8GB LPDRR5 memory, and up to 256GB eMMC flash, plus ...

According to PC Gamer, “The AMD Ryzen 7 7800X3D is simply the best gaming CPU around right now. It’s certainly the best ...

在过去的五十多年里，半导体行业一直依赖 IBM 于 1967 年推出的 Tomasulo 算法来构建针对特定计算任务的专用 CPU、GPU 和其他芯片。然而，Ubitium 打破了这一传统模式，将所有计算工作负载整合到一个价格亲民的芯片中。

I-Pi SMARC Amston Lake devkit specifications: LEC-ASL SMARC 2.1 module Amston Lake SoC – Intel Atom x7433RE quad-core processor with 6MB cache, 32EU Intel UHD graphics; 9W TDP System Memory – 8GB ...

Advanced Micro Devices has a strong product pipeline and a growing ecosystem similar to CUDA. See why AMD stock is a Buy.

Learn More Intel has been struggling to keep up with AMD and Nvidia but there might finally be some good news for investors.

12 月 27 日消息，英伟达在过去两年通过 AI 的热潮创下了收入新纪录，不过如今英伟达正面临着日益增长的压力 —— 不仅来自竞争对手 AMD，还来自传统上依赖英伟达 GPU的超大规模数据中心（Hyperscalers），这些公司现在正在寻求减少对英伟达硬件的依赖。 在博通最近的财报电话会议上，博通总裁兼首席执行官陈福阳（Hock Tan）便对英伟达进行“狙击”，其声称自家已坐拥三家超大规模客户 ...

存储器，包括DRAM（动态随机存取存储器）和NAND（闪存），一直是半导体行业的重要组成部分，存储器市场的增长为半导体产业带来了新的增长点，推动了半导体产业的进一步发展。特别是近年来随着以ChatGPT为代表的生成式人工智能（AI）技术的不断发展和普 ...