The seafood packaging market , valued at USD 1.3 billion in 2024, is projected to exceed USD 2 billion by 2034, reflecting a steady CAGR of 4.3%. This growth is driven by increasing global demand for ...
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.
Apple will be taking advantage of TSMC’s very latest chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal). SoIC-mH refers to a method of integrating different ...
It’s believed some of the upcoming M5 chips will also use TSMC’s 2.5D packaging technology. Apple’s M-series Mac chips each include a central processing unit, a graphics processing unit ...
Amkor Technology Inc. has secured as much as $407 million in CHIPS Act grants from the White House for its proposed advanced semiconductor packaging and testing plant in metro Phoenix. The U.S ...