Semiconductor Packaging News
Chinese cyber association calls for review of Intel products sold in China China's Cybersecurity Association has urged a review of Intel's products, accusing the chipmaker of threatening national security with flawed processors that expose users to potential data theft.
Semiconductor Packaging News
Find out the latest news and insights on semiconductor packaging, from technology advancements to market trends. Read about topics such as AI, smartphones, cloud computing, sustainability, and more.
Semiconductor Packaging News Index
3DIO IP For Multi-Die Integration The semiconductor industry is turning to advanced packaging solutions like 2.5D & 3D integration to meet growing demands for high-performance ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
5 天之前 · The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness …
Semiconductor Packaging News Technical Paper Index
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Semiconductor Packaging News
Partitioning In The Chiplet Era Chiplets are revolutionizing domain-specific applications, but designers face complex partitioning challenges. New features require intricate data mapping & signal integrity balancing, while scaling limitations & disaggregation demand careful decisions on power, performance & integration.
This Startup Shows Why the U.S. CHIPS Act Is Needed
4 天之前 · Ideal Semiconductor, based at Lehigh University, is a prime example of the challenges U.S. semiconductor startups face. Its founders advocated for the CHIPS Act, which they believe could halve development time and costs. Their innovative SuperQ transistor design overcomes traditional limitations ...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; …
3 天之前 · TSMC has signed a memorandum with Amkor Technology to provide advanced packaging and test services for its Arizona plants. Both companies secured CHIPS Act funding to support their facilities, accelerating chip production and packaging for U.S. customers ...
Intel Glass Core Substrate Update - Semiconductor Packaging News
Intel Glass Core Substrate Update: Summary INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus on glass core substrates, integral to their Advanced Packaging roadmap unveiled in September 2023.
•Die attach material revenue will growata CAGR of nearly 4percent. • Solder ball revenue will expand ata CAGR of3percent. • The WLP dielectrics market is expected to increaseby, a 9 percentCAGR. • The wafer-level plating chemical market is forecasted ata CAGR ofover 7percent. The Global Semiconductor Packaging Materials Outlook is a comprehensive market research